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Wafer-Thin Digital Camera Technology Developed

June 11th, 2007 · Source · No Comments

Tessera Technologies has created OptiML WLC, a new process that helps to shrink digital camera components for use in devices such as cell phones. The new technology reduces the size by 50% and costs by 30%, making the camera modules smaller and cheaper for integration into other electronics. It works by manufacturing thousands of lenses simultaneously on a wafer and bonding them together to create the optical element. The optics will still allow for auto-focus and digital optical zoom, all without moving parts.

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  • Tags: In The News · Camera

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