Today Qualcomm announced three new mobile chipsets that support high-speed wireless connectivity and advanced features. The three chips include one for HSPA+, one for EV-DO Rev. B, and one that combines HSPA+ and EV-DO Rev. B compatibility onto a single chip. All three also include ARM11 processors, Bluetooth 2.1+EDR, FM radios and GPS. The chips measure 12mm by 12mm and can handle 5 Megapixel cameras and TV-out, operating systems such as Windows Mobile and Linux, and accelerated graphics. The chips will be backward compatible with previous generation technologies and will be sampling in the fourth quarter of 2008.
Qualcomm Develops Advanced 3G Chips
November 14th, 2007 · Source [Qualcomm] · No Comments
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